RESIN MOLDED ELECTRONIC PART

PURPOSE:To provide a resin molded electronic part which is stable in quality, and free of the current leakage due to flux remaining on the surface of a resin mold at the time of mounting to a circuit board, etc. CONSTITUTION:In an electronic part equipped with a resin mold part 5 and lead terminals...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TERAJIMA SHOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a resin molded electronic part which is stable in quality, and free of the current leakage due to flux remaining on the surface of a resin mold at the time of mounting to a circuit board, etc. CONSTITUTION:In an electronic part equipped with a resin mold part 5 and lead terminals 3 and 4 being bent toward the bottom side of the resin mold part 5, projecting from both right and left flanks of that resin mold part 5, at least one groove lying parallel with the opposite edges of the bottom is made at that bottom of the resin mold part 5.