ELECTROLESS PLATING APPARATUS

PURPOSE:To suppress the remaining and sticking of fine copper powder by using a flexible transparent plastic tube as a pipe for transferring a plating soln. used for connecting an electroless plating soln. tank to a plating soln. adjustment tank. CONSTITUTION:A plating soln. 7 in an electroless plat...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIZAWA IZURU, HATTORI HIROMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To suppress the remaining and sticking of fine copper powder by using a flexible transparent plastic tube as a pipe for transferring a plating soln. used for connecting an electroless plating soln. tank to a plating soln. adjustment tank. CONSTITUTION:A plating soln. 7 in an electroless plating tank 1 is transferred to a plating soln. adjustment tank 2, the pH and copper concn. of the plating soln. 7 are adjusted and the plating soln. 7 is recycled as a copper replenishing source to the plating tank 1. A transparent plastic tube such as a transparent soft PE tube is used as a pipe 3 for transferring the plating soln. 7. Since the tube is flexible, a joint is unnecessary and a smooth continuous structure free from a joint is ensured. The plating soln. stagnates hardly in the tube and the remaining and sticking of fine copper powder due to the deposition of copper in the pipe 3 are hardly caused.