EPOXY RESIN COMPOSITION

PURPOSE:To obtain an epoxy resin composition improved in resistance to soldering stress and flow by mixing a specified epoxy resin with an inorganic filler, a phenolic resin curing agent and a cure accelerator. CONSTITUTION:An epoxy resin component containing 50-100wt.%, based on the total epoxy resin amount, epoxy resin of formula I (wherein R1 to R8 are each H, a halogen or an alkyl) is mixed with 70-93wt.% inorganic filler having a content of particles with particle diameters of 0.5wt.% and having a mean particle diameter of 5-15mum, 30-100wt.%, based on the total phenolic resin curing agent amount, flexible phenolic resin curing agent comprising a compound of formula II (wherein (r) is p-xylylene; and (n) is 0-8) and a compound of formula III (wherein R is a residue derived by removing the two phenolic moieties from dicyclopentadienediphenol, terpenephenol, cyclopentadienediphenol or cyclohexanonediphenol; and (n) is 0-8) and a cure accelerator.