MULTILAYER INTERCONNECTION BOARD INCORPORATING THIN-FILM RESISTOR

PURPOSE:To set the resistance of an incorporated thin-film resistor to a predeter mined desired value. CONSTITUTION:In the multilayer interconnection board where an insulation layer 4 and a wiring conductor film 6 are laminated in a plurality of layers on a substrate 1 and at least one layer out of...

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Bibliographische Detailangaben
Hauptverfasser:	TATEISHI HIDEKI, KAWAI AKINARI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To set the resistance of an incorporated thin-film resistor to a predeter mined desired value. CONSTITUTION:In the multilayer interconnection board where an insulation layer 4 and a wiring conductor film 6 are laminated in a plurality of layers on a substrate 1 and at least one layer out of the wiring conductor film 6 is constituted of a resistance film 3 for forming a thin-film resistor, the layer of an inorganic insulation material film 2 is formed between the resistance film 3 and the insulation film 4 under the resistance film 3. Then, the thickness of the layer of the inorganic insulation material film 2 is set to approximately that of a reaction layer generated between the inorganic insulation material film 2 and the insulation film 4, thus preventing the resistance of the resistance film 3 from fluctuating due to the reaction layer generated between the insulation film 4 and the resistance film 3 when the resistance film 3 is formed directly on the insulation film 4 and obtaining a predetermined desired resistance as the resistance of the resistance film 4.