WIRE BONDING APPARATUS AND METHOD

PURPOSE:To efficiently obtain a wire bonding apparatus and a semiconductor device having high reliability by the apparatus in which maintenance and repair of the apparatus can be suitably executed by accurately grasping the state of the apparatus. CONSTITUTION:A wire bonding apparatus wire bonds a m...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SATOU RIYOUKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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