WIRE BONDING APPARATUS AND METHOD

WIRE BONDING APPARATUS AND METHOD

PURPOSE:To efficiently obtain a wire bonding apparatus and a semiconductor device having high reliability by the apparatus in which maintenance and repair of the apparatus can be suitably executed by accurately grasping the state of the apparatus. CONSTITUTION:A wire bonding apparatus wire bonds a m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SATOU RIYOUKO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To efficiently obtain a wire bonding apparatus and a semiconductor device having high reliability by the apparatus in which maintenance and repair of the apparatus can be suitably executed by accurately grasping the state of the apparatus. CONSTITUTION:A wire bonding apparatus wire bonds a metal fine wire by bringing a capillary 12 into contact with an electrode of a semiconductor device 13, and comprises a bonding checking stage 20 disposed at a touchable position with the capillary 12, and a strain sensor 21 disposed at a touchable position on a rear surface of the stage 20.