METHOD AND DEVICE FOR POLISHING WAFER

PURPOSE:To improve the quality of a wafer and reduce the facility cost by preventing the scattering of fine powder, etc., of abrasive produced by the polishing of a wafer. CONSTITUTION:The drying of the abrasive supplied between a polishing face 3a and a wafer 5 is prevented by partitioning off at l...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEDA KEISUKE, SHIRAI KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To improve the quality of a wafer and reduce the facility cost by preventing the scattering of fine powder, etc., of abrasive produced by the polishing of a wafer. CONSTITUTION:The drying of the abrasive supplied between a polishing face 3a and a wafer 5 is prevented by partitioning off at least, a region including a polishing face 3a and a wafer 5 from the outside, and polishing it while maintaining the inside of its division in enough wet condition.