LEAD FRAME FORMING MATERIAL

PURPOSE:To produce a large quantity of a lead frame having uniform quality by making a photosensitive material to contain a diazo salt photosensitive resin and a lipophilic polymer compound insoluble in water and soluble in alkaline water. CONSTITUTION:A substrate made of copper, copper alloy, or ni...

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Bibliographische Detailangaben
Hauptverfasser:	KAKEI TSUTOMU, NARUSE YASUTO, MOROHOSHI KOICHI, KAMIYA KIYOSHI, UESUGI AKIO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To produce a large quantity of a lead frame having uniform quality by making a photosensitive material to contain a diazo salt photosensitive resin and a lipophilic polymer compound insoluble in water and soluble in alkaline water. CONSTITUTION:A substrate made of copper, copper alloy, or nickel alloy is coated with a photosensitive material on both faces, it is dried, wound, or laminated to obtain a lead frame forming material. A diazo salt photosensitive resin and a lipophilic polymer compound insoluble in water and soluble in alkaline water are contained in the photosensitive material; or a light-dimerization type photosensitive composition is contained; or a negative type resist composition constituted of a resin insoluble in water and soluble in alkaline water, a compound generating acid when active light or radioactive rays are radiated, and a compound having at least one group capable of ross-linking by the action of acid is used for the photosensitive material. The working process is simplified, and the dust sticking problem and excessive loss can be avoided.