METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT
PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a...
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| creator | SHIMADA SHIGEO |
| description | PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a thin equipment, a heating element 4 is provided turned to an outside of an equipment 2, a heat dissipation member 5 mounted on the heating element 4 is arranged outside a housing of the equipment 2, the element 4 is mounted on one side in a longitudinal direction of the heat dissipation member 5 and heat of the heating element 4 is dissipated directly to an outside through the heat dissipation member 5. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH07235787A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH07235787A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH07235787A3</originalsourceid><addsrcrecordid>eNrjZLDwdQ3x8HdRcPRzUXBxDfN0dlVw8w9S8HB1DFFw8QwO9gxwDPH091Pwd1MI8fD0U3ANDPUM8HX1C-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4G5kbGpuYW5o7GxKgBAEbKKIM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT</title><source>esp@cenet</source><creator>SHIMADA SHIGEO</creator><creatorcontrib>SHIMADA SHIGEO</creatorcontrib><description>PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a thin equipment, a heating element 4 is provided turned to an outside of an equipment 2, a heat dissipation member 5 mounted on the heating element 4 is arranged outside a housing of the equipment 2, the element 4 is mounted on one side in a longitudinal direction of the heat dissipation member 5 and heat of the heating element 4 is dissipated directly to an outside through the heat dissipation member 5.</description><edition>6</edition><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>1995</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950905&DB=EPODOC&CC=JP&NR=H07235787A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19950905&DB=EPODOC&CC=JP&NR=H07235787A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIMADA SHIGEO</creatorcontrib><title>METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT</title><description>PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a thin equipment, a heating element 4 is provided turned to an outside of an equipment 2, a heat dissipation member 5 mounted on the heating element 4 is arranged outside a housing of the equipment 2, the element 4 is mounted on one side in a longitudinal direction of the heat dissipation member 5 and heat of the heating element 4 is dissipated directly to an outside through the heat dissipation member 5.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1995</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwdQ3x8HdRcPRzUXBxDfN0dlVw8w9S8HB1DFFw8QwO9gxwDPH091Pwd1MI8fD0U3ANDPUM8HX1C-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4G5kbGpuYW5o7GxKgBAEbKKIM</recordid><startdate>19950905</startdate><enddate>19950905</enddate><creator>SHIMADA SHIGEO</creator><scope>EVB</scope></search><sort><creationdate>19950905</creationdate><title>METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT</title><author>SHIMADA SHIGEO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH07235787A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1995</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIMADA SHIGEO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIMADA SHIGEO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT</title><date>1995-09-05</date><risdate>1995</risdate><abstract>PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a thin equipment, a heating element 4 is provided turned to an outside of an equipment 2, a heat dissipation member 5 mounted on the heating element 4 is arranged outside a housing of the equipment 2, the element 4 is mounted on one side in a longitudinal direction of the heat dissipation member 5 and heat of the heating element 4 is dissipated directly to an outside through the heat dissipation member 5.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
| title | METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T16%3A51%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIMADA%20SHIGEO&rft.date=1995-09-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH07235787A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |