METHOD AND DEVICE FOR HEAT DISSIPATION OF THIN EQUIPMENT

PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a...

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Bibliographische Detailangaben
1. Verfasser:	SHIMADA SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a heat dissipation method for improving heat dissipation of a thin electronic/electric equipment regarding a heat dissipation method of an electronic part in an electronic/electric equipment, etc., whose whole device is thin and flat. CONSTITUTION:As a heat dissipation method of a thin equipment, a heating element 4 is provided turned to an outside of an equipment 2, a heat dissipation member 5 mounted on the heating element 4 is arranged outside a housing of the equipment 2, the element 4 is mounted on one side in a longitudinal direction of the heat dissipation member 5 and heat of the heating element 4 is dissipated directly to an outside through the heat dissipation member 5.