DIELECTRIC MASK FOR LASER BEAM MACHINING AND ITS PRODUCTION

PURPOSE:To obtain a dielectric mask having good pattern accuracy by forming patterns for lift-off of a material consisting of a polyimide system on a substrate which allows transmission of laser beams and forming multilayered dielectric films thereon, then removing the patterns for lift-off and the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SATO HIDEMI, TOGAWA HIDEO, TERABAYASHI TAKAO, AMAMIYA KYOKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To obtain a dielectric mask having good pattern accuracy by forming patterns for lift-off of a material consisting of a polyimide system on a substrate which allows transmission of laser beams and forming multilayered dielectric films thereon, then removing the patterns for lift-off and the multilayered dielectric films. CONSTITUTION:The patterns (lift-off layers) 3 for lift-off are formed by using the material consisting the polyimide system on the quartz glass substrate 1. The polyimide material is stable at a high temp. and many of the polyimide materials are formable to a thickness of several mum. High-accuracy patterning with these materials is easy by dry etching, etc. In addition, the lift-off layers 3 are easily formable by using a polar solvent, etc. The multilayered dielectric films 6 are then formed on the substrate 1 formed with such lift-off layers 3. The lift-off layers 3 and the multilayered dielectric films 6 on the lift-off layers are removed from the surface of the substrate. As a result, the dielectric mask having the good pattern accuracy and higher laser resistance is easily obtd. even for various kinds of dielectric materials and more particularly the multilayered dielectric films 6 having a large film thickness.