PRINTED BOARD

PURPOSE:To prevent design failure in board design wherein a CAD system is used. CONSTITUTION:Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KATSUKI KENICHI, OZAWA KIYOSHI, TANPO HIROAKI, SEKINO YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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