PRINTED BOARD

PURPOSE:To prevent design failure in board design wherein a CAD system is used. CONSTITUTION:Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the...

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Bibliographische Detailangaben
Hauptverfasser:	KATSUKI KENICHI, OZAWA KIYOSHI, TANPO HIROAKI, SEKINO YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent design failure in board design wherein a CAD system is used. CONSTITUTION:Lands 9, 10 for soldering a part are enlarged wider than electrodes 4, 5 or a part outer shape range 6 of a part 3 to be mounted, and are printed in a printed board. Solder resists 12, 13 are applied to the lands 9, 10 making a solder effective region remain. For CAD design, the lands 9, 10 are regarded as a part outer shape range and a wiring pattern is designed. Then, designing is possible without causing design failure of shortcircuiting of a pattern 11 with the electrode 5 in a printed board. Since designing regarding the lands 9, 10 as a part outer shape range is possible, it is not required to set a macro arrangement forbidden region.