SEMICONDUCTOR PACKAGE

PURPOSE:To realize a package structure which is suitable for an automated process by a method wherein a dummy terminal is provided on each corner of a lead frame and the dummy terminal has horizontal protrusions and vertical protrusions. CONSTITUTION:Dummy terminals 5 are provided on a lead frame for a surface- mount type glass-sealed package. The dummy terminals 5 are provided on the corner parts of the frame 1 which holds lead terminal 2 groups by connecting the lead terminal 2 groups vertically to it. Each dummy terminal 5 has horizontal protrusions 8 and vertical protrusions 9 adjacent to the lead terminal 2 group. If the dummy terminal 5 which has a larger width than the lead terminal 2 is provided adjacent to the lead terminal 2, the lead terminal 2 is mechanically protected and, further, the penetration of glass is avoided. Moreover, the horizontal protrusions 8 can be used as recognition patterns of an automatic machine and the vertical protrusions 9 can be used for positioning between the lead frame and a base ceramic board, etc.