APPARATUS AND METHOD FOR POSITIONING WAFER

PURPOSE:To improve positioning accuracy and reduce the production cost con cerning an apparatus and method for positioning a wafer which is adopted for a dicing process where semiconductor ships are separated discretely from a wafer step and they are mounted on a stage of a lead frame. CONSTITUTION:The apparatus is provided with a light x27 for irradiating a specified area with a band-like light in an X-axis direction, a light y28 for irradiating a specified area with a band-like light in an Y-axis direction and a light a29 for irradiating the crossing position of the respective band-like lights which are irradiated by the lights x27 and y28 with a spotted light. Further, it is also provided with a sensor 30 for detecting the light which is irradiated by the light x27 and transmitted through a wafer 21, a sensor 31 for detecting the light which is irradiated by the light y28 and transmitted through the wafer 21, a sensor 32 for detecting the light which is irradiated by the light a29 and transmitted through the wafer 21, and a CPU for controlling the driving of a table 24 and moving the wafer 21 so that all the sensors 30-32 can receive the lights irradiated by the respective lights 27-29.