CONDUCTIVE RESIN PASTE COMPOSITION AND SEMICONDUCTOR DEVICE

PURPOSE:To contrive to develop a conductive resin paste composition, which can be hardened in a short time, is little bled out onto the plated surface of a metal frame and is superior in bleeding resistance. CONSTITUTION:A conductive resin paste composition is formed by a method wherein it contains...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KAWASUMI MASAO, YAMAZAKI MITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To contrive to develop a conductive resin paste composition, which can be hardened in a short time, is little bled out onto the plated surface of a metal frame and is superior in bleeding resistance. CONSTITUTION:A conductive resin paste composition is formed by a method wherein it contains (a) an epoxy resin, (b) a hardener, (c) a conductive filler and (d) an ethylene fluoride resin and the wt. % of (d) the ethylene fluoride resin is set at 0.1 to 3wt.% to that of the conductive resin paste composition and a semiconductor device is formed by a method wherein a semiconductor element is bonded on a substrate using the composition and thereafter, the element is sealed.