HEAT TREATING DEVICE

PURPOSE:To provide a heat treating device which has minimized temperature changes in the boundary region in a split heater structure. CONSTITUTION:Each of two split heater groups 40 is counterposed in parallel with a wafer W housed inside a reaction tube 20 in between. An upper group of heaters of t...

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1. Verfasser: SASAKI KIYOHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide a heat treating device which has minimized temperature changes in the boundary region in a split heater structure. CONSTITUTION:Each of two split heater groups 40 is counterposed in parallel with a wafer W housed inside a reaction tube 20 in between. An upper group of heaters of the reaction tube 20 comprise an upper center zone 42a, an upper rear zone 43a in its periphery, an upper left side zone 44a, an upper front zone 45a, and an upper right side zone 46a, while a lower group of heaters comprise a lower center zone 42b, a lower rear zone 43b in its periphery, a lower left side zone 44b, a lower front zone 45b, and a lower right side zone 46b. Each zone arranged in the periphery of the lower center zones 42a and 42b is placed staggered to make each boundary not to face each other.