EPOXY RESIN COMPOSITION FOR SEALING LED, AND LED

PURPOSE:To prevent the precipitation of chlorine contained in an epoxy resin by hydrolysis so as to prevent the oxidation of an Al component (luminance deterioration of an LED) by chlorine. CONSTITUTION:An epoxy resin composition 3 used for sealing a GaAlAs compound semiconductor chip 1 contains a l...

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Bibliographische Detailangaben
1. Verfasser:	KUROKI SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the precipitation of chlorine contained in an epoxy resin by hydrolysis so as to prevent the oxidation of an Al component (luminance deterioration of an LED) by chlorine. CONSTITUTION:An epoxy resin composition 3 used for sealing a GaAlAs compound semiconductor chip 1 contains a light-transmissive epoxy resin, curing agent composed of an acid anhydride, hardening accelerator, and halogen ion exchanger of