MANUFACTURE OF SEMICONDUCTOR PACKAGE

PURPOSE: To provide a manufacture of the semiconductor package of a lead on-chip type in which the adhering process of a semiconductor chip is improved, the cost is saved, the process is simplified and the reliability of the semiconductor package is enhanced. CONSTITUTION: This manufacturing method of the semiconductor package of a lead on-chip type, where a semiconductor chip 39 is mounted on inner leads 31 of a lead frame 30, includes a process where a polyimide coating material for wafer protection is coated to an adhesion face between the semiconductor chip 39 and the inner leads 31 and bus bars 35 of the lead frame 30, and also includes an attach process where the semiconductor chip 39 is adhered and mounted, by using the polyimide coating material applied onto the inner leads 31 and the bus bars 35 as a medium, and a process where a boding pad of the semiconductor chip 39 and the inner leads 31 are connected by wires and a package body is covered to protect the semiconductor chip 39 and the wires.