HEAT DISSIPATING MECHANISM OF IC PACKAGE
PURPOSE:To prevent the decrease of thermal conductivity due to the gap of a pressure contact surface between an IC package and a heat sink, and ensure heat dissipating function, by putting clay state thermosetting adhesive silicon compound having fire retardance, thermal conductivity and electric in...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To prevent the decrease of thermal conductivity due to the gap of a pressure contact surface between an IC package and a heat sink, and ensure heat dissipating function, by putting clay state thermosetting adhesive silicon compound having fire retardance, thermal conductivity and electric insulating properties between the IC package and the heat sink. CONSTITUTION:A CPU 3 is mounted on a printed wiring board (PCB) 5. Clay state thermosetting adhesive silicon composition 1 which has fire retardance, thermal conductivity and electric insulating properties and is worked in the same size of 3mm in thickness as the CPU 3 is stuck on the upper surface of the CPU 3. A heat sink 2 is pressed on the composition from above, and fastened and fixed to the PCB 5 by using a pressing part member constituted of screws 4a, washers 4b and nuts. The clay state silicon composition 1 is cured in a temperature range of 100-180 deg.C by the heat generated from the CPU 3, and bonded to the heat sink 2 and the CPU 3. |
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