PACKAGE FOR SEMICONDUCTOR

PURPOSE:To restrain the mismatching of characteristic impedance of a line, and reduce the reflection of a microwave signal, by setting the width of wirings for a microwave line and the isolation distance of a ground wiring from the wirings for a microwave line, so as to ensure the impedance matching with wirings on a printed board for mounting. CONSTITUTION:The width of wirings 21 for an RF line, i.e., the width W1 of a through hole trench 17 for the RF line, and the isolation distance between the wirings 21 and each of the ground wirings 22, 23, i.e., the isolation distance G1 between the through hole trench 17 and each of the ground through hole trenches 18, 19 are adjusted, and the characteristic impedance of a coplanar line on the side surface 15 of an insulative board 13 is adjusted. Thereby the impedance matching with wirings or the like on a printed board for mounting is enabled. Hence the mismatching of characteristic impedance in the whole line can easily be prevented, and the reflection of a microwave signal can be reduced.