TAPE FOR SEMICONDUCTOR INTEGRATED CIRCUIT FILM CARRIER, MANUFACTURE THEREOF, FILM CARRIER BASED THEREON AND MANUFACTURE OF THE FILM CARRIER

PURPOSE:To prevent contamination due to adhesive in and around sprocket holes, by forming an adhesive layer and a protective film virtually across the full width of a base film and making in the protective film one or more pairs of cuts, continuing in the direction of length. CONSTITUTION:An adhesive layer 2 is formed on a base film 1 almost across its full width, including sprocket hole areas. A protective film 3 is formed on the adhesive layer 2 almost across its full width. The protective film 3 is divided into a center part 3c and both end parts 3a, 3b by cuts 5a, 5b made along an area of a specified width where copper foil films are to be laminated. When a film carrier is made of such a tape, only the center part 3c of the protective film is peeled off, and copper foil films bonded together are laminated there. Thus the sprocket hole areas are covered with the protective film; therefore, the machinery will not be contaminated by adhesive and the like during a film carrier preparing process.