MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To provide excellent dimensional accuracy of a viahole of a polyimide resin film and to accurately expose a surface of an Al bonding pad by increasing the shape and the size of the viahole in a second polyimide resin film larger than those of a viahole in a first polyimide resin film layer....

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Bibliographische Detailangaben
1. Verfasser:	SEKINE HIROYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide excellent dimensional accuracy of a viahole of a polyimide resin film and to accurately expose a surface of an Al bonding pad by increasing the shape and the size of the viahole in a second polyimide resin film larger than those of a viahole in a first polyimide resin film layer. CONSTITUTION:The shape and the size of a viahole in a second polyimide resin film 6 is controlled by regulating the developing and etching times with alkaline aqueous solution to be larger than those of a first layer viahole 5. Then, using the obtained first and second polyimide resin films 4, 6 as mask materials, an inorganic insulating layer 3 of an upper part of an Al bonding pad 2 of a wiring layer is dry-etched by using mixed gas of fluorine, and the pad 2 is exposed. An exposed part 7 is formed in shape smaller than that of the pad of the layer 2, thereby obtaining a moisture resistant reliability of a semiconductor device using it.