FIXING DEVICE FOR RADIOACTIVE GAS, AND PRODUCTION OF SPUTTER ELECTRODE

PURPOSE:To unify the wearing thickness of electrode due to sputtering and extend the life of sputter electrodes by making all or part near the surface of sputter electrodes with a layer of intermetallic compound mixed uniformly with rare earth metal atoms and transition metal atoms. CONSTITUTION:By...

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Hauptverfasser: ISHIWATARI YUTAKA, HAGIWARA MITSUHARU, FUJIMOTO YUJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To unify the wearing thickness of electrode due to sputtering and extend the life of sputter electrodes by making all or part near the surface of sputter electrodes with a layer of intermetallic compound mixed uniformly with rare earth metal atoms and transition metal atoms. CONSTITUTION:By making the surface of sputter electrode with a layer of intermetallic compound 102 mixed uniformly in atom level with rare earth metal atoms 106 and transition metal atoms 105, it is avoided that rare earth metal dominantly wears, and abrasion becomes uniform and so, the life of the sputter electrode can be improved. Furthermore, as the metal compound layer 102 has higher strength at high temperature than a single substance of rare earth metals and transition metals, there is no danger of falling of the sputter electrode due to the self-weight and causing damage of the device even in heating to high temperature during the use. Also by making a mixture layer of rare earth metal particles and transition metal particles on the sputter electrode and sintering it, the transition metal atoms diffuse in the rare earth metal particles and thus, a structure in which the compound layer 102 is scattered in the transition metal 103, is obtained.