JOINING METHOD USING PHOTOSENSITIVE RESIN

PURPOSE:To provide a joining method by which each joint and joining material can be isolated from the outside air and the dropping and flowing out of a joining material can be easily prevented at the time of joining a first member with a second member by wrapping the joints and joining material with...

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Bibliographische Detailangaben
Hauptverfasser:	MIYASAKA TAKAO, KANBE HAJIME, KODAIRA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a joining method by which each joint and joining material can be isolated from the outside air and the dropping and flowing out of a joining material can be easily prevented at the time of joining a first member with a second member by wrapping the joints and joining material with an ultraviolet curing resin. CONSTITUTION:In a joining method in which leads 58 are joined to circuit wiring 52 by using cream solder 54, the joining section of each lead 58 is closely adhered to the corresponding joining section of the wiring 52 with the solder 54 in between and, at the same time, the joint and solder 54 are wrapped with an ultraviolet curing resin 10. After curing the resin 10 by exposing the resin to ultraviolet rays, the lead 58 is joined with the wiring 52 by using the solder 54.