HEAT SINK

PURPOSE:To obtain a heat sink which can operate at a temperature lower than the freezing point even when pure water is used as a working liquid while exhibiting excellent heat dissipation properties. CONSTITUTION:The heat sink comprises a heat receiving block 1 to be fixed with a heating element, e....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI NOBUO, OGAWARA HIROYUKI, ISAKA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain a heat sink which can operate at a temperature lower than the freezing point even when pure water is used as a working liquid while exhibiting excellent heat dissipation properties. CONSTITUTION:The heat sink comprises a heat receiving block 1 to be fixed with a heating element, e.g., a semiconductor element, requiring the cooling, a unit 4 for dissipating the transmitted heat, and a plurality of heat pipes 2, 9 having one end buried in the heat receiving block and the other end for dissipating heat through the unit 4, wherein at least one heat pipe has heat dissipation resistance higher than those of other heat pipes.