TEST RECEPTACLE AND PREPARATION OF KGD USING TEST RECEPTACLE

PURPOSE: To supply many KGDs in an inexpensive way by mounting many semiconductor chips having bump electrodes on a single substrate, and separating the semiconductor chips having the bumps from the substrate after a burn-in test. CONSTITUTION: A test socket 20 is made of a substrate 21 with one or more land patterns 23 formed thereon as well as connected to an external connection terminal 22 via metallic wiring 24, and many semiconductor chips 25 with one or more bump electrodes 26 formed thereon. Many of the semiconductor chips 25, when mounted on the substrate 21, are attached, so as to joint the electrodes 26 to the land patterns 23, and bonded at a reflow soldering process. A burn-in test is, then, conducted and thereafter heat is applied for separating the chips 25 having the bump electrodes 26 from the substrate substrate 21. Then, KGD arrays identified as free from a defect through the burn-in test are sequentially transferred, thereby easily manufacturing many KGDs.