SEMICONDUCTOR MANUFACTURING METHOD
PURPOSE:To uniformly conduct the dry-process treatment on wafers of any position in a reaction chamber. CONSTITUTION:In this semiconductor manufacturing method in which a plurality of wafers 14 are arranged in a reaction chamber 11 where reaction gas is allowed to flow and the dry process such as et...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | PURPOSE:To uniformly conduct the dry-process treatment on wafers of any position in a reaction chamber. CONSTITUTION:In this semiconductor manufacturing method in which a plurality of wafers 14 are arranged in a reaction chamber 11 where reaction gas is allowed to flow and the dry process such as etching, ashing and the like of wafer is conducted, the interval of wafers is provided in such a manner that it is gradually becomes wider from the upstream to the downstream. |
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