FORMATION OF PRINTED WIRING PATTERN

PURPOSE:To achieve the improvement of electric property and prevention of exfoliation by bringing the shape of the cross section of a copper wiring pattern close to a rectangle. CONSTITUTION:The shape of the cross section of a plated resist pattern 5, which is made on the surface of a laminate lined...

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Bibliographische Detailangaben
Hauptverfasser:	WAJIMA MOTOYO, YOSHITOMI SATOSHI, AKABOSHI HARUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE:To achieve the improvement of electric property and prevention of exfoliation by bringing the shape of the cross section of a copper wiring pattern close to a rectangle. CONSTITUTION:The shape of the cross section of a plated resist pattern 5, which is made on the surface of a laminate lined with copper, lying on an insulating substrate 1 is put in the shape of an over hang such as that the top juts out in an opening 6. Next, copper plating is performed in the opening, and etching resists 9 are formed on the head, where the copper plating is exposed, and the side face, and then the plating resist is exfoliated, and the base copper foil is etched off so as to form a copper wiring pattern 10 rectangular in cross section.