HOT DIPPING DEVICE FOR METAL STRIP

PURPOSE:To provide a hot dipping device for metal strip, in which a plating treated surface of high quality can be formed without sticking dross on the surface of the metal strip. CONSTITUTION:The metal strip 4 is continuously dipped into a main bath vessel 1 stored with hot dipping liquid 2 and the...

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Bibliographische Detailangaben
Hauptverfasser:	SHINOHARA AKITOSHI, SHIGEMOTO HARUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a hot dipping device for metal strip, in which a plating treated surface of high quality can be formed without sticking dross on the surface of the metal strip. CONSTITUTION:The metal strip 4 is continuously dipped into a main bath vessel 1 stored with hot dipping liquid 2 and the hot dipping liquid is sprayed toward the metal strip in the hot dipping liquid. Further, a sub-bath vessel 7 stored with hot dipping liquid 14 with a temp. and concn. adjusted to prescribed values, respectively is provided separately from the main bath vessel. Then the hot dipping liquid in the sub-bath vessel is sprayed on the surface of the metal strip in the main bath vessel through a supplying means 8.