LAMINATED MODULE OF SEMICONDUCTOR PACKAGE

LAMINATED MODULE OF SEMICONDUCTOR PACKAGE

PURPOSE: To provide a stacking module for fitting a large number of semiconductor packages on a limited board surface with a high density. CONSTITUTION: A stacking module is composed of a pair of plates 10 arranged vertically opposite to each other at a specified interval, and each plate 10 is compo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIN KIYOUSHIYOU, KEN GOSHIYOKU, TEI GENCHIYOU, BOKU HANRETSU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: To provide a stacking module for fitting a large number of semiconductor packages on a limited board surface with a high density. CONSTITUTION: A stacking module is composed of a pair of plates 10 arranged vertically opposite to each other at a specified interval, and each plate 10 is composed of a large number of through-holes 11 for fitting a large number of semiconductor packages 1 to the plate 10, and a large number of conductive lines for uniting the through-holes 11 mutually.