WIRE BONDING EQUIPMENT

PURPOSE:To set a wire bonding equipment free from discharge failures so as to prevent balls from being misshaped by a method wherein a thin metal wire is corrected in amount of feed by a feed control correction clamper before a discharge takes place based on the output of a recognition device which judges that a wire is adequate or not in feed. CONSTITUTION:A wire bonding equipment is equipped with an electric torch 6 which enables a discharge 8 to take place for forming a gold ball 7 on the tip of a thin metal wire 2, a bonding tool 5, and a feed control correction clamper 4 which corrects a thin metal wire 2 in feed 9 required for a discharge 8. When a discharge failure occurs, the feed control correction clamper 4 is closed, a thin metal wire cutting clamper 3 is opened, and the feed control correction clamper 4 is driven so as to set the thin metal wire 2 optimal in amount of feed 9 recognizing the feed 9 of the thin metal wire 2 by a recognition equipment 10. At this point, an automatic wire feed apparatus 1 takes up or feeds the thin metal wire 2 by an amount of wire driven by the feed control correction clamper 4. After the thin metal wire 2 is corrected in feed 9, the metal fine wire cutting clamper 3 is closed, and a discharge 8 is made to take place.