EPOXY RESIN MOLDING MATERIAL FOR SEALING

PURPOSE:To provide the title material which is excellent in mold-filling properties in the full mold process, does not cause wire sweep such as aluminum wire sweep, has excellent sealing and molding properties, and exhibits an improved humidity resistance after molded. CONSTITUTION:The material cont...

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Bibliographische Detailangaben
Hauptverfasser:	ICHIKAWA MASAYA, MIYATANI YOSHIHIRO, IKEDA KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the title material which is excellent in mold-filling properties in the full mold process, does not cause wire sweep such as aluminum wire sweep, has excellent sealing and molding properties, and exhibits an improved humidity resistance after molded. CONSTITUTION:The material contains an epoxy resin, crystalline silica, and a polyhydric alcohol. The amt. of crystalline silica contained acounts for 75-90-wt.% of the total amt. of the material not contg. the alcohol. The amt. of the alcohol contained is 0.1-3.0wt.% of the total amt. of the material not contg. the alcohol.