THIN-FILM SENSOR

PURPOSE:To break heat conduction from a signal processing circuit and then prevent the characteristic change of a sensor due to temperature increase by packaging the sensor consisting of a thin-film resistor on an elevated packaged which is erected on a substrate. CONSTITUTION:An elevated package 4 is erected on a circuit substrate 3 and a thin-film resistance sensor 1 is packaged on the upper surface. The elevated package 4 is provided with a plurality of legs 5 which also play the role of lead wires and is electrically connected to a signal processing circuit 2 via the legs 5. Therefore, even if heat generated at the circuit 2 is transferred to the substrate 3, heat is insulated by the package 4, thus nearly preventing heat from being transferred to the sensor 1 and hence enabling the sensor 1 to achieve its original performance without being affected by heat.