SEMICONDUCTOR SEALING DEVICE

PURPOSE:To obtain the title semiconductor sealing device capable of retaining the injection function and the hydraulic function of a transfer device by a method wherein hydraulic energy required for a series of resin injection work is previously accumulated to be fed to a hydrualic system when a main power supply is disconnected. CONSTITUTION:The title semiconductor sealing device is provided with a clamping device 11 clamping a metallic mold 10, a transfer device 12 including a hydraulic system for injecting a resin in the metallic mold 10 and a main power supply 14 feeding the power for driving at least the hydraulic system. In such a semiconductor sealing device, the hydraulic energy required for a series of resin injection work in the transfer device 12 is previously accumulated to be fed to the hydraulic system when the main power supply 14 is disconnected. For example, an accumulator 15, a detector detecting the disconnection of the main power supply 14, an uninterruptible power supply device 16, a transfer valve 17, etc., are additionally provided.