POLISHING METHOD FOR SEMICONDUCTOR WAFER

PURPOSE:To provide a polishing method whereby flatness is improved in the case of polishing a semiconductor wafer by using a lapping machine. CONSTITUTION:In the case that a semiconductor wafer 3, inserted to a carrier 2, is press-interposed to be polished by using a lapping machine constituted of u...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SHIBAYAMA TAKASANE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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