POLISHING METHOD FOR SEMICONDUCTOR WAFER

PURPOSE:To provide a polishing method whereby flatness is improved in the case of polishing a semiconductor wafer by using a lapping machine. CONSTITUTION:In the case that a semiconductor wafer 3, inserted to a carrier 2, is press-interposed to be polished by using a lapping machine constituted of u...

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Bibliographische Detailangaben
1. Verfasser:	SHIBAYAMA TAKASANE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide a polishing method whereby flatness is improved in the case of polishing a semiconductor wafer by using a lapping machine. CONSTITUTION:In the case that a semiconductor wafer 3, inserted to a carrier 2, is press-interposed to be polished by using a lapping machine constituted of upper/lower surface plates 4, 1 rotated each other, by setting a thickness (tc) of the carrier 2 in use smaller than a thickness (tw) of the semiconductor wafer 3 by 0.35twmum or more, the semiconductor wafer of good flatness can be obtained by suppressing a sagging phenomenon of the upper surf ace plate 4.