MANUFACTURE OF CHIP TYPE FUSE

PURPOSE:To provide a chip type fuse ensuring strong adhesion between a ceramic substrate and an electrode, and high solder heat resistance and productivity. CONSTITUTION:A resist film 9 is formed between a conductor circuit 3 and an electrode laid on the surface of a ceramic substrate 2. Furthermore...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MORITA HIROSHI, TAKEOKA TETSUO, HIROYAMA YUKIHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide a chip type fuse ensuring strong adhesion between a ceramic substrate and an electrode, and high solder heat resistance and productivity. CONSTITUTION:A resist film 9 is formed between a conductor circuit 3 and an electrode laid on the surface of a ceramic substrate 2. Furthermore, a metal film having a low fusion point is formed on the upper surface of the circuit 3 and the electrode, and the exposed surface of the substrate 2 and the upper surface of the metal film are covered with a silicone film 10.