MAGNETIC SPUTTERING CATHODE

PURPOSE:To exchange a first magnet without the exchange of whole magnetron sputtering cathode and to easily control film thickness distribution on a substrate. CONSTITUTION:A yoke plate fixing permanent magnets 4, 5, 6, 7 forming magnetic fileds on a nonmagnetic body target 2 is divided into a yoke...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HIRANO HIROYUKI, SUWA HIDENORI, IMAMURA SATOSHI, NAGASAWA SHOJI, BOKU SHIYOUSHIYOKU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To exchange a first magnet without the exchange of whole magnetron sputtering cathode and to easily control film thickness distribution on a substrate. CONSTITUTION:A yoke plate fixing permanent magnets 4, 5, 6, 7 forming magnetic fileds on a nonmagnetic body target 2 is divided into a yoke plate 11 fixing permanent magnet 4, 5 and a yoke plate 10 fixing permanent magnets 6, 7 and by attaching and detaching the yoke plate 11 from the yoke plate 10, the permanent magnet 5 different in the side can be exchanged.