MOUNTING STRUCTURE OF INTEGRATED CIRCUIT PACKAGE

PURPOSE:To obtain the mounting structure of an integrated circuit package to a flexible wiring substrate without generating a breaking at a joint or a wiring pattern. CONSTITUTION:An opening 9 is provided at a cover film 6 which is formed on a wiring pattern 5 of a flexible wiring substrate 3 for exposing a wiring pattern terminal part corresponding to the lead terminal part of an integrated circuit package 1, the integrated circuit package 1 is laid out so that a tip part 2b of the lead terminal of the integrated circuit package 1 is mounted on it exceeding the opening 9 of the cover film 6, and then a contacting part 2b of the lead terminal and the terminal of the wiring pattern 5 are connected by soldering 8. The cover film 6 is pressed at a tip part 2a of the lead terminal and bending stress is dispersed, thus preventing a joint and the wiring pattern from being broken.