MANUFACTURE OF MOLDED PRODUCT WITH CIRCUIT

PURPOSE:To facilitate the electronic circuit formation by a method wherein, after the plating step of a non-platy molded product, a required pattern is formed of an etching resist ink in an ink jetting mode and after drying up and baking steps, to be etched away for releasing the resist. CONSTITUTION:A box type molded product manufactured by transfer-molding a molding material comprising 100wt.% of a hardner containing epoxy resin (hereinafter simply written in %) whereto 200% of silica, 10% of acrylonitrile rubber, 1% of stearic acid and 1% of carbon black are added to be electrolyric copper-plated later. Next, the molded product with circuit is manufactured by emitting, drying up an etching resist ink in a required pattern shape in an ink jetting mode and after baking step, to be etched away for releasing the resist. Through these procedures, a non-platy molded product easy to form an electronic circuit can be manufactured.