BUMP ELECTRODE FOR FACE DOWN BONDING OF FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND ITS PRODUCTION

PURPOSE:To provide a flip chip type semiconductor device face down bonding bump electrode which prevents deterioration of adhesiveness between the metal electrode on a semiconductor chip face down bonding surface and a solder bump by permitting the the metal of a middle metal layer to diffuse into t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RAI AKITERU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!