BUMP ELECTRODE FOR FACE DOWN BONDING OF FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND ITS PRODUCTION

BUMP ELECTRODE FOR FACE DOWN BONDING OF FLIP CHIP TYPE SEMICONDUCTOR DEVICE AND ITS PRODUCTION

PURPOSE:To provide a flip chip type semiconductor device face down bonding bump electrode which prevents deterioration of adhesiveness between the metal electrode on a semiconductor chip face down bonding surface and a solder bump by permitting the the metal of a middle metal layer to diffuse into t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: RAI AKITERU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE:To provide a flip chip type semiconductor device face down bonding bump electrode which prevents deterioration of adhesiveness between the metal electrode on a semiconductor chip face down bonding surface and a solder bump by permitting the the metal of a middle metal layer to diffuse into the solder bump. CONSTITUTION:A solder bump 8 is provided on an aluminum electrode 2 on the face down bonding side surface of a semiconductor chip 1 through a middle metal layer 5 which has at least one copper-nickel alloy film (4-3).