OPTICAL MODULATOR AND METHOD FOR FORMING ELECTRIC CONTACT OF OPTICAL MODULATOR

OPTICAL MODULATOR AND METHOD FOR FORMING ELECTRIC CONTACT OF OPTICAL MODULATOR

PURPOSE: To eliminate the need for precise positioning by boring a hole which extends to the surface of an electrode in an insulating layer formed on the surface of the electrode. CONSTITUTION: A 1st-level hole 20 is formed penetrating a 1st-level insulating layer 22 and many holes 20 are formed in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAIKERU EI BAAKOBUITSUTSU, MAAKU ESU BAANSUTAIN, HENRII DABURIYUU SAN JIYUNIA
Format: Patent
Sprache:eng
Schlagworte:
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:PURPOSE: To eliminate the need for precise positioning by boring a hole which extends to the surface of an electrode in an insulating layer formed on the surface of the electrode. CONSTITUTION: A 1st-level hole 20 is formed penetrating a 1st-level insulating layer 22 and many holes 20 are formed in respective electrodes so as to obtain excellent electric contacts. Further, a 2nd-level hole 24 is bored in a 2nd-level insulating layer 26 and this 2nd-level hole 24 is preferably much larger than the 1st-level hole 20, but preferably does not expand onto an adjacent electrode. One 2nd-level hole 24 bored for each electrode surrounds all 1stlevel holes 20 below it. Further, the metal layer 16 of a contact pad is vapor-deposited filling the holes of the insulating layer, a solder projection 18 is formed thereupon, and the contact pad and projection 18 may expand onto an adjacent electrode.