JPH0680910B

To increase the heat capacity of a heat sink and heat dissipating structure combined with an electrical component, typically a transistor, for example of the TO 220 or SOT 93 type, a heat transferring base plate (3), with the interposition of an insulating, heat conducting foil (6), engages one flat surface of the element (11), and a second heat transferring element (17) is provided, pressed by a spring (24) against the other major surface, or a portion of the component (11). A plastic holder (7) is provided, attached to the base plate (3) for example by snap-in hooks (8), formed with openings to receive the component, and position the component against the base plate while, also, being formed with abutments to position the second heat transferring element which, for example, is block or plate-like. The spring, preferably, is a leaf spring having projecting arms extending, from both sides of a central portion (25), over two adjacently located components (11) and the second heat transferring elements (17) respectively, and engaging the holder (7) to form a subassembly therewith, the subassembly then being riveted, by rivets extending through the spring (24) to the base plate.