EPOXY RESIN COMPOSITION AND SEALED SEMICONDUCTOR DEVICE

PURPOSE:To obtain the subject composition, consisting essentially of a specific naphthalene ring-containing epoxy resin, a novolak type phenolic resin and an inorganic filler, excellent in moisture and solder heat resistance, capable of reducing leakage currents and useful as sealed semiconductor devices, etc. CONSTITUTION:The objective epoxy resin composition is obtained by using (A) an epoxy resin similar to bis(glycidyloxysilyl)-alpha-naphthyl-methane expressed by the formula {R is a group expressed by CjH2j+1 [(j) is 0 or an integer of >=1]; R is a group expressed by CkH2k+1 [(k) is 0 or an integer of >=1]} with (B) a novolak type phenolic resin and (C) an inorganic filler (e.g. silica powder) as essential components, adding the component (C) in an amount of 25-90wt.% based on the resin composition and further mixing a curing accelerator, ester waxes and a silane coupling agent, etc., therewith. Thereby, this epoxy resin composition provides sealed semiconductor devices, excellent in moisture and solder heat resistance and capable of remarkably reducing breakage of wires due to corrosion of electrodes and occurrence, etc., of leakage currents due to moisture and assuring the reliability for a long period.