EXTRUSION-MOLDED SHEET-SHAPED MATERIAL AND INSULATING BOARD

PURPOSE:To enable efficient production of an extrusion-molded sheet low in anisotropy and excellent in flatness by using a small-scale facility and to provide an insulating board excellent in soldering resistance, dimensional stability and mechanical properties, exhibiting flame retardancy, free fro...

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Hauptverfasser:	AKI KENZOU, YAMAUCHI SHIGERU, NAKAYAMA YASUKI, KUSUNOKI MIKIO, TANIMOTO KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To enable efficient production of an extrusion-molded sheet low in anisotropy and excellent in flatness by using a small-scale facility and to provide an insulating board excellent in soldering resistance, dimensional stability and mechanical properties, exhibiting flame retardancy, free from plating bath pollution and applicable to wide-range industries. CONSTITUTION:With 100 pts.wt. polyester containing >=85mol% 1,4- cyclohexanedimethanol terephthalate-based repeating unit, (1) 5 to 50 pts.wt. fiber-shaped reinforcing material, (2) 5 to 50 pts.wt. granular inorganic compound, (3) 10 to 40 pts.wt. organic halide compound and (4) 5 to 20 pts.wt. sodium antimony are blended and the resultant mixture is extrusion-molded and hot-pressed.