THERMOPLASTIC RESIN COMPOSITION

PURPOSE:To obtain a thermoplastic resin composition giving films having good processability, toughness, scratch resistance, heat resistance, shock resistance, chemical resistance and high transparency by adding a modified polyolefin to an amorphous polyolefin and a specific methacrylic resin. CONSTI...

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1. Verfasser: FURUKAWA SADAFUMI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To obtain a thermoplastic resin composition giving films having good processability, toughness, scratch resistance, heat resistance, shock resistance, chemical resistance and high transparency by adding a modified polyolefin to an amorphous polyolefin and a specific methacrylic resin. CONSTITUTION:100 pts.wt. resin composition comprising (A) 5 to 95wt.% amorphous polyolefin such as a ring-opening polymer of dicyclopentadiene and (B) 95 to 5wt.% methacrylic resin formed by copolymerization of methyl methacrylate only or a mixture thereof with at least one of other copolymerizable vinyl or vinylidene monomers together with at least one of acids such as acrylic acid and/or an acid anhydride such as maleic anhydride are admixed to 1 to 20 pts.wt. modified polyolefin such as ethylene-glycidyl methacrylate to give the objective resin composition having excellent processability, toughness, resistances to scratch, heat, shock, oil, chemical, water and moisture.