METHOD FOR DIVIDING OF BONDED WAFER INTO PIECES
PURPOSE: To perform a cleaving process appropriately by a cutting roughly an upper layer starting from an upper surface for a junction wafer and at the same time cutting roughly a lower layer starting from a lower surface at the same point. CONSTITUTION: A junction wafer 1 is constituted of an upper...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE: To perform a cleaving process appropriately by a cutting roughly an upper layer starting from an upper surface for a junction wafer and at the same time cutting roughly a lower layer starting from a lower surface at the same point. CONSTITUTION: A junction wafer 1 is constituted of an upper layer 2 that is made of silicon and a lower layer 3 that is made of glass. Then, an upper saw blade 4 cuts only the upper layer 2 made of silicon, and a lower saw blade 5 cuts only the lower layer 3 made of glass. The saw blades 4 and 5 are used normally to cut a material. When the material is made of glass or silicon, the saw blades 4 and 5 with a diamond particle are used. Therefore, a cleaving process can be adapted to the characteristics of a layer to be subjected to cutting at each time. Also, with the cleaving process that is adapted to the layer at each time, time required for cutting and the wear of a tool can be reduced. |
---|