WIRING BOARD

PURPOSE:To obtain a wiring board with wiring conductors formed without line disorder with high precision and with excellent adhesion to the board, and free from protruding from the upper surface of the board. CONSTITUTION:Grooves of a specified pattern are provided on the upper surface of a glass bo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIBA NOBUYASU, IIDA HIDEYO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To obtain a wiring board with wiring conductors formed without line disorder with high precision and with excellent adhesion to the board, and free from protruding from the upper surface of the board. CONSTITUTION:Grooves of a specified pattern are provided on the upper surface of a glass board 2, and wiring conductors are formed by burying metal oxide films 3 and conductive materials 4 in the grooves 2a. Accordingly, it becomes possible to form the wiring conductors along the groove pattern with high precision without line disorder. In addition, it becomes possible to increase the thickness of the wiring conductors preventing them from protruding from the upper surface of the board 2 by making the grooves deeper. And it is possible to make the wiring conductors have specified values of resistance, even when the wiring conductors have to be formed extremely narrow in width. Besides, it becomes possible to prevent the wiring conductors from exfoliating, floating up, etc., securely, by raising the adhesion of the conductive materials 4 to the glass board 2 by the use of the metal oxide films 3.